Vaisman Chasin, AdrianAdrianVaisman ChasinScholz, MirkoMirkoScholzGuo, WeiWeiGuoFranco, JacopoJacopoFrancoPotoms, GoedeleGoedelePotomsJourdain, AnneAnneJourdainLinten, DimitriDimitriLintenVan der Plas, GeertGeertVan der PlasAbsil, PhilippePhilippeAbsilBeyne, EricEricBeyne2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27427Impact of wafer thinning on front-end reliability for 3D integrationProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=7574562