Caers, J.F.J.M.J.F.J.M.CaersZhao, X.J.X.J.ZhaoLekens, GeertGeertLekensDreesen, R.R.DreesenCroes, K.K.CroesWong, E.H.E.H.Wong2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/7268Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesivesProceedings paper