On the reliability of Cu contacts for the 32nm technology node and beyond

Kauerauf, ThomasThomasKaueraufDemuynck, StevenStevenDemuynckButera, GeniGeniButeraBogan, JustinJustinBoganTokei, ZsoltZsoltTokeiGroeseneken, GuidoGuidoGroeseneken2021-10-172021-10-172009https://imec-publications.be/handle/20.500.12860/15574On the reliability of Cu contacts for the 32nm technology node and beyondProceedings paper