La Manna, AntonioAntonioLa MannaBuisson, ThibaultThibaultBuissonDetalle, MikaelMikaelDetalleRebibis, Kenneth JuneKenneth JuneRebibisVelenis, DimitriosDimitriosVelenisZhang, WenqiWenqiZhangBeyne, EricEricBeyne2021-10-202021-10-202012-06https://imec-publications.be/handle/20.500.12860/20972Challenges and improvements for 3D-IC integration using ultra thin (25μm) devicesProceedings paper