Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Vandevelde, BartBartVandeveldeLabie, RietRietLabieLauwaert, RalphRalphLauwaertWerkhoven, DanielDanielWerkhovenVanderstraeten, DanielDanielVanderstraetenBlansaer, EddyEddyBlansaerLannoo, JonasJonasLannooPissoort, DavyDavyPissoort2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/34304Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-QProceedings paperhttps://ieeexplore.ieee.org/document/8724511