Cu/Sn microbumps interconnect for 3D TSV chip stacking

Agarwal, RahulRahulAgarwalZhang, WenqiWenqiZhangLimaye, PareshPareshLimayeLabie, RietRietLabieDimcic, BiljanaBiljanaDimcicPhommahaxay, AlainAlainPhommahaxaySoussan, PhilippePhilippeSoussan2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16632Cu/Sn microbumps interconnect for 3D TSV chip stackingProceedings paper