Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using of oxygen free fluorcarbon plasma

Mannaert, GeertGeertMannaertBaklanov, MikhaïlMikhaïlBaklanovLe, Quoc ToanQuoc ToanLeTravaly, YoussefYoussefTravalyBoullart, WernerWernerBoullartVanhaelemeersch, SergeSergeVanhaelemeersch2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10843Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using of oxygen free fluorcarbon plasmaProceedings paper