A method to pattern tight tip-to-tip in 32nm-pitch N5 interconnect using Ru area selective deposition tone inversion process

Briggs, BasoeneBasoeneBriggsSoethoudt, JobJobSoethoudtDelabie, AnneliesAnneliesDelabieWilson, ChrisChrisWilsonTokei, ZsoltZsoltTokeiBoemmels, JuergenJuergenBoemmelsDevriendt, KatiaKatiaDevriendtSebaai, FaridFaridSebaaiLorant, ChristopheChristopheLorantHody, HubertHubertHody2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30328A method to pattern tight tip-to-tip in 32nm-pitch N5 interconnect using Ru area selective deposition tone inversion processOral presentationhttp://mam2018.mdm.imm.cnr.it/MAM2018.pdf