Parameter study for the reliability of underfilled flip chip and CSP assemblies

Vandevelde, BartBartVandeveldeDegryse, DominiekDominiekDegryseBeyne, EricEricBeyneVandepitte, D.D.VandepitteBaelmans, M.M.Baelmans2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6994Parameter study for the reliability of underfilled flip chip and CSP assembliesProceedings paper