Adhesion study between materials for integration of copper and inorganic low-k dielectrics

Lanckmans, FilipFilipLanckmansBrongersma, SywertSywertBrongersmaPoortmans, JefJefPoortmansConard, ThierryThierryConardBender, HugoHugoBenderBeyne, EricEricBeyneMaex, KarenKarenMaex2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5427Adhesion study between materials for integration of copper and inorganic low-k dielectricsOral presentation