Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Inoue, FumihiroFumihiroInoueIacovo, SerenaSerenaIacovoEl-Mekki, ZaidZaidEl-MekkiKim, Soon-WookSoon-WookKimStruyf, HerbertHerbertStruyfBeyne, EricEricBeyne2022-04-252021-12-042022-04-012022-04-2520210741-3106WOS:000722001400036https://imec-publications.be/handle/20.500.12860/38529Area-Selective Electroless Deposition of Cu for Hybrid BondingJournal article10.1109/LED.2021.3124960WOS:000722001400036LAYER