Civale, YannYannCivaleRedolfi, AugustoAugustoRedolfiJaenen, PatrickPatrickJaenenKostermans, MaartenMaartenKostermansVan Besien, ElsElsVan BesienMertens, SofieSofieMertensWitters, ThomasThomasWittersJourdan, NicolasNicolasJourdanArmini, SilviaSilviaArminiVandersmissen, KevinKevinVandersmissenPhilipsen, HaroldHaroldPhilipsenVerdonck, PatrickPatrickVerdonckHeylen, NancyNancyHeylenNolmans, PhilipPhilipNolmansLi, YunlongYunlongLiCroes, KristofKristofCroesBeyer, GeraldGeraldBeyerSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20468Through-silicon via technology for three-dimensional integrated circuit manufacturingProceedings paper