Mask absorber, mask tone, and wafer process impact on resist line-edge-roughness

Ohtomi, EisukeEisukeOhtomiPhilipsen, VickyVickyPhilipsenWelling, UlrichUlrichWellingMelvin III, Lawrence S.Lawrence S.Melvin IIITakahata, YosukeYosukeTakahataTanaka, YusukeYusukeTanakaDe Simone, DaniloDaniloDe Simone2024-03-252024-02-272024-03-2520231932-5150WOS:001134890300015https://imec-publications.be/handle/20.500.12860/43597Mask absorber, mask tone, and wafer process impact on resist line-edge-roughnessJournal article10.1117/1.JMM.22.4.044801WOS:001134890300015