Yield improvement for 3D wafer-to-wafer stacked ICs using wafer matching

Taouil, MottaqiallahMottaqiallahTaouilHamdioui, SaidSaidHamdiouiMarinissen, Erik JanErik JanMarinissen2021-10-222021-10-2220151084-4309https://imec-publications.be/handle/20.500.12860/25982Yield improvement for 3D wafer-to-wafer stacked ICs using wafer matchingJournal articlehttp://dl.acm.org/citation.cfm?id=2699832