Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation

Zahedmanesh, HoumanHoumanZahedmaneshGonzalez, MarioMarioGonzalezCiofi, IvanIvanCiofiCroes, KristofKristofCroesBoemmels, JuergenJuergenBoemmelsTokei, ZsoltZsoltTokei2021-10-232021-10-2320160026-2714https://imec-publications.be/handle/20.500.12860/27647Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigationJournal articlehttp://www.sciencedirect.com/science/article/pii/S0026271416300154