Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration

Jourdain, AnneAnneJourdainSchleicher, FilipFilipSchleicherDe Vos, JoeriJoeriDe VosStucchi, MicheleMicheleStucchiChery, EmmanuelEmmanuelCheryMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerVan der Plas, GeertGeertVan der PlasWalsby, EdwardEdwardWalsbyRoberts, KerryKerryRobertsAshraf, HumaHumaAshrafThomas, DaveDaveThomasBeyne, EricEricBeyne2022-01-102021-11-022022-01-1020200569-5503WOS:000620983200008https://imec-publications.be/handle/20.500.12860/38145Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous IntegrationProceedings paper10.1109/ECTC32862.2020.00020978-1-7281-6180-8WOS:000620983200008