Die to wafer 3D stacking for below 10μm pitch microbumps

Derakhshandeh, JaberJaberDerakhshandehHou, LinLinHouDe Preter, IngeIngeDe PreterGerets, CarineCarineGeretsSuhard, SamuelSamuelSuhardDubey, VikasVikasDubeyJamieson, GeraldineGeraldineJamiesonInoue, FumihiroFumihiroInoueWebers, TomasTomasWebersBex, PieterPieterBexCapuz, GiovanniGiovanniCapuzBeyne, EricEricBeyneSlabbekoorn, JohnJohnSlabbekoornWang, TengTengWangJourdain, AnneAnneJourdainBeyer, GeraldGeraldBeyerRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMiller2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26538Die to wafer 3D stacking for below 10μm pitch microbumpsProceedings paperhttp://ieeexplore.ieee.org/document/7969993/