Substrate bonding techniques for CMOS processed wafers

van der Groen, SonjaSonjavan der GroenRosmeulen, MaartenMaartenRosmeulenBaert, KrisKrisBaertJansen, PhilippePhilippeJansenDeferm, LudoLudoDeferm2021-09-302021-09-301997https://imec-publications.be/handle/20.500.12860/2218Substrate bonding techniques for CMOS processed wafersJournal article