Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer

Inoue, FumihiroFumihiroInouePodpod, ArnitaArnitaPodpodPeng, LanLanPengPhommahaxay, AlainAlainPhommahaxayRebibis, Kenneth JuneKenneth JuneRebibisUedono, AkiraAkiraUedonoBeyne, EricEricBeyne2021-10-282021-10-2820201525-6125https://imec-publications.be/handle/20.500.12860/35307Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si waferJournal articlehttps://doi.org/10.1016/j.jmapro.2020.08.050