Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices

Beyne, EricEricBeyne2021-10-202021-10-202012https://imec-publications.be/handle/20.500.12860/20360Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices – Technology directionsProceedings paperhttp://ieeexplore.ieee.org/document/6262977/?arnumber=6262977