Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules

Posada Quijano, GuillermoGuillermoPosada QuijanoCarchon, GeertGeertCarchonNauwelaers, BartBartNauwelaersDe Raedt, WalterWalterDe Raedt2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14337Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modulesProceedings paper