Wafer scale copper direct plating on thin PVD RuTa layers: a route to enable filling 30 nm features and below?

Armini, SilviaSilviaArminiEl-Mekki, ZaidZaidEl-MekkiNagar, MagiMagiNagarRadisic, AlexAlexRadisicRuythooren, WouterWouterRuythoorenVereecken, PhilippePhilippeVereecken2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23501Wafer scale copper direct plating on thin PVD RuTa layers: a route to enable filling 30 nm features and below?Proceedings paperhttp://ecst.ecsdl.org/content/58/17/3.abstract