Perry, DanDanPerryRay, UrmiUrmiRayGu, SamSamGuNakamoto, MarkMarkNakamotoSy, WingWingSyWang, KevinKevinWangRuythooren, WouterWouterRuythoorenYang, YuYuYangDe Wolf, IngridIngridDe WolfCotrin Teixeira, RicardoRicardoCotrin TeixeiraGonzalez, MarioMarioGonzalezSimons, VeerleVeerleSimonsBerry, Christopher J.Christopher J.BerryLee, KiWookKiWookLeeBurggraf, JürgenJürgenBurggrafPargfrieder, StefanStefanPargfrieder2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/16009Impact of thinning and packaging on a deep sub-micron CMOS productOral presentation