FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3

Tao, ZhengZhengTaoZhang, LipingLipingZhangDupuy, EmmanuelEmmanuelDupuyChan, BTBTChanAltamirano Sanchez, EfrainEfrainAltamirano SanchezLazzarino, FredericFredericLazzarino2021-10-292021-10-292020https://imec-publications.be/handle/20.500.12860/36052FEOL dry etch process challenges of ultimate FinFET scaling and next generation device architectures beyond N3Meeting abstracthttps://doi.org/10.1117/12.2552022