Exploring the use of Tungsten-based Hard Masks in BEOL interconnects for 3nm node and beyond

Montero Alvarez, DanielDanielMontero AlvarezVega Gonzalez, VictorVictorVega GonzalezPuliyalil, HarinarayananHarinarayananPuliyalilNie, JiuyuanJiuyuanNieYang, JialingJialingYangSchleicher, FilipFilipSchleicherMclaughlin, KevinKevinMclaughlinVersluijs, JankoJankoVersluijsLazzarino, FredericFredericLazzarinoPark, SeonghoSeonghoParkTokei, ZsoltZsoltTokei2024-04-092022-11-232024-04-092022-11-10https://imec-publications.be/handle/20.500.12860/40770Exploring the use of Tungsten-based Hard Masks in BEOL interconnects for 3nm node and beyondOral presentationMaterials sciencetungsten carbide3nm nodehard maskline roughnessselectivityplasma etch resistance