Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

Chew, Soon AikSoon AikChewYu, HaoHaoYuSchaekers, MarcMarcSchaekersDemuynck, StevenStevenDemuynckMannaert, GeertGeertMannaertKunnen, EddyEddyKunnenRosseel, ErikErikRosseelHikavyy, AndriyAndriyHikavyyDangol, AnishAnishDangolDe Meyer, KristinKristinDe MeyerMocuta, DanDanMocutaHoriguchi, NaotoNaotoHoriguchiLeusink, GertGertLeusinkWajda, CoryCoryWajdaHakamata, TTHakamataHasegawa, TTHasegawaTapily, KKTapilyClark, RRClark2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28023Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metalProceedings paperhttp://ieeexplore.ieee.org/document/7968969/