Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration

Labie, RietRietLabieDuflos, FredericFredericDuflosVandevelde, BartBartVandeveldeAllaert, BartBartAllaertLauwaert, RalphRalphLauwaertWillems, GeertGeertWillems2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/31102Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibrationProceedings paperhttps://ieeexplore.ieee.org/document/8369920