Peng, LanLanPengKim, Soon-WookSoon-WookKimInoue, FumihiroFumihiroInoueWang, TengTengWangPhommahaxay, AlainAlainPhommahaxayVerdonck, PatrickPatrickVerdonckJourdain, AnneAnneJourdainSleeckx, ErikErikSleeckxStruyf, HerbertHerbertStruyfMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneSoules, MikeMikeSoulesLutter, StefanStefanLutter2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27130Development of multi-stack dielectric wafer bondingProceedings paperhttp://ieeexplore.ieee.org/document/7583082/