Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology

Van Huylenbroeck, StefaanStefaanVan HuylenbroeckDe Vos, JoeriJoeriDe VosTeugels, LieveLieveTeugelsIacovo, SerenaSerenaIacovoFodor, FerencFerencFodorMiller, AndyAndyMillerVan der Plas, GeertGeertVan der PlasBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2022-03-162022-03-1620210569-5503WOS:000702282700161https://imec-publications.be/handle/20.500.12860/39458Multi-tier N=4 Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding TechnologyProceedings paper10.1109/ECTC32696.2021.00173978-0-7381-4523-5WOS:000702282700161