Novel patterning shrink technique enabling sub-50nm trench and contact integration

Demuynck, StevenStevenDemuynckTokei, ZsoltZsoltTokeiZhao, ChaoChaoZhaode Marneffe, Jean-FrancoisJean-Francoisde MarneffeStruyf, HerbertHerbertStruyfBoullart, WernerWernerBoullartOp de Beeck, MaaikeMaaikeOp de BeeckCarbonell, LaureLaureCarbonellHeylen, NancyNancyHeylenVaes, JanJanVaesBeyer, GeraldGeraldBeyerVanhaelemeersch, SergeSergeVanhaelemeerschZhu, HelenHelenZhuCirigliano, PeterPeterCiriglianoKim, J. S.J. S.KimVertommen, JohanJohanVertommenCoenegrachts, BartBartCoenegrachtsSadjadi, R.R.SadjadiPavel, E.E.PavelAthayde, A.A.Athayde2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/12050Novel patterning shrink technique enabling sub-50nm trench and contact integrationProceedings paper