TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumps

Gerets, CarineCarineGeretsDerakhshandeh, JaberJaberDerakhshandehBex, PieterPieterBexLofrano, MelinaMelinaLofranoCherman, VladimirVladimirChermanCochet, TomTomCochetRebibis, Kenneth JuneKenneth JuneRebibisBeyer, GeraldGeraldBeyerMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30763TCB optimization for stacking large thinned dies with 40 and 20μm pitch microbumpsProceedings paperhttps://ieeexplore.ieee.org/document/8546425