Thermal-Mechanical analysis of Electroplated copper for IC packaging

Salahouelhadj, AbdellahAbdellahSalahouelhadjVanstreels, KrisKrisVanstreelsDe Messemaeker, JokeJokeDe MessemaekerGerets, CarineCarineGeretsSlabbekoorn, JohnJohnSlabbekoornEl-Mekki, ZaidZaidEl-MekkiMudigere Krishne Gowda, PunithPunithMudigere Krishne GowdaGonzalez, MarioMarioGonzalezBeyne, EricEricBeyne2025-02-152025-02-152024979-8-3503-9037-72687-9700WOS:001340802800136https://imec-publications.be/handle/20.500.12860/45216Thermal-Mechanical analysis of Electroplated copper for IC packagingProceedings paper10.1109/ESTC60143.2024.10712132979-8-3503-9036-0WOS:001340802800136ELASTIC-MODULUSGRAIN-SIZEFILMSSTRESSHARDNESSINDENTATION