CMP processing to enable 3D stacked IC integration

Vaes, JanJanVaesHeylen, NancyNancyHeylenVan Olmen, JanJanVan OlmenHuyghebaert, CedricCedricHuyghebaertLeunissen, PeterPeterLeunissen2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/16340CMP processing to enable 3D stacked IC integrationProceedings paper