One micron redistribution for fan-out wafer level packaging

Flack, WarrenWarrenFlackHsieh, RobertRobertHsiehNguyen, Ha-AiHa-AiNguyenSlabbekoorn, JohnJohnSlabbekoornLorant, ChristopheChristopheLorantMiller, AndyAndyMiller2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28336One micron redistribution for fan-out wafer level packagingProceedings paperhttp://ieeexplore.ieee.org/document/8277536/