Baert, KrisKrisBaertDe Moor, PietPietDe MoorTilmans, HarrieHarrieTilmansJohn, JoachimJoachimJohnWitvrouw, AnnAnnWitvrouwVan Hoof, ChrisChrisVan HoofBeyne, EricEricBeyne2021-10-152021-10-152004-06https://imec-publications.be/handle/20.500.12860/8512More than just a package - wafer-level packaging of MEMSJournal article