Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitch

Bogaerts, LieveLieveBogaertsDe Vos, JoeriJoeriDe VosGerets, CarineCarineGeretsJamieson, GeraldineGeraldineJamiesonVandersmissen, KevinKevinVandersmissenLa Manna, AntonioAntonioLa Manna2021-10-202021-10-202012-12https://imec-publications.be/handle/20.500.12860/20372Process related challenges for 3D stacking test vehicles using a 40/50μm CuSn microbump pitchProceedings paper