Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison of for several IC-packages

Vandevelde, BartBartVandeveldeGonzalez, MarioMarioGonzalezLimaye, PareshPareshLimayeRatchev, PetarPetarRatchevBeyne, EricEricBeyne2021-10-152021-10-152004-05https://imec-publications.be/handle/20.500.12860/9830Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison of for several IC-packagesProceedings paper