Overlay performance of through Si via last lithography for 3d packaging

Flack, WarrenWarrenFlackHsieh, RobertRobertHsiehKenyon, GarethGarethKenyonSlabbekoorn, JohnJohnSlabbekoornCzarnecki, PiotrPiotrCzarneckiTobback, BertBertTobbackVan Huylenbroeck, StefaanStefaanVan HuylenbroeckStucchi, MicheleMicheleStucchiVandeweyer, TomTomVandeweyerMiller, AndyAndyMiller2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/26623Overlay performance of through Si via last lithography for 3d packagingProceedings paperhttp://ieeexplore.ieee.org/document/7861543/