Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module

Van Huylenbroeck, StefaanStefaanVan HuylenbroeckLi, YunlongYunlongLiStucchi, MicheleMicheleStucchiBogaerts, LieveLieveBogaertsDe Vos, JoeriJoeriDe VosBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneBrouri, MohandMohandBrouriNalla, PraveenPraveenNallaGopinath, SanjaySanjayGopinathThorum, MatthewMatthewThorumRichardson, JoeJoeRichardsonYu, JengyiJengyiYu2021-10-232021-10-232016https://imec-publications.be/handle/20.500.12860/27468Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV moduleProceedings paperhttp://ieeexplore.ieee.org/document/7970001/