Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

Van Steenberge, NeleNeleVan SteenbergeLimaye, PareshPareshLimayeWillems, GeertGeertWillemsVandevelde, BartBartVandeveldeSchildermans, IngeIngeSchildermans2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/13100Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assemblyJournal article