Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using oxygen-free fluorocarbon plasma

Mannaert, GeertGeertMannaertBaklanov, MikhaïlMikhaïlBaklanovLe, Quoc ToanQuoc ToanLeTravaly, YoussefYoussefTravalyBoullart, WernerWernerBoullartVanhaelemeersch, SergeSergeVanhaelemeerschJonas, A.M.A.M.Jonas2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10844Minimizing plasma damage and in situ sealing of ultra low-k dielectric films by using oxygen-free fluorocarbon plasmaJournal article