Optimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay Performance

Hsu, AlexAlexHsuJadli, ImeneImeneJadliSuhard, SamuelSamuelSuhardJourdain, AnneAnneJourdainMiller, AndyAndyMillerTamaddon, Amir-HosseinAmir-HosseinTamaddonKennes, KoenKoenKennesDe Poortere, EtienneEtienneDe PoortereBlanco, VictorVictorBlanco2026-04-272026-04-272025979-8-3315-3782-12380-632Xhttps://imec-publications.be/handle/20.500.12860/59196In this work, we characterize the in-plane and out-of-plane deformation of the dies following the imec die-to-wafer (D2W) bonding flow. By leveraging this result of alignment readout and leveling metrologies on scanner, we could improve the post-D2W bonding overlay performance through scanner precorrection for advanced packaging and heterogeneous integration system.engOptimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay PerformanceProceedings paper10.1109/IITC66087.2025.11075428WOS:001554227600045