Pinel, S.S.PinelTasselli, J.J.TasselliLepinois, F.F.LepinoisMarty, A.A.MartyBailbe, J. P.J. P.BailbeBeyne, EricEricBeyneVan Hoof, RitaRitaVan HoofMarco, S.S.MarcoMorante, J. R.J. R.Morante2021-10-142021-10-142001https://imec-publications.be/handle/20.500.12860/5580Ultra thin chip vertical integration techniqueProceedings paper