High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Druais, GaelGaelDruaisDilliway, G.G.DilliwayFischer, P.P.FischerGuidotti, E.E.GuidottiLuhn, OleOleLuhnRadisic, AlexAlexRadisicZahraoui, S.S.Zahraoui2021-10-172021-10-1720080167-9317https://imec-publications.be/handle/20.500.12860/13677High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seedJournal article