Binary and ternary intermetallics for advanced interconnect metallization

Soulie, Jean-PhilippeJean-PhilippeSoulieHeylen, NancyNancyHeylenSankaran, KiroubanandKiroubanandSankaranScheerder, JeroenJeroenScheerderFleischmann, ClaudiaClaudiaFleischmannSwerts, JohanJohanSwertsTokei, ZsoltZsoltTokeiAdelmann, ChristophChristophAdelmann2024-05-282024-05-282024-04https://imec-publications.be/handle/20.500.12860/43976Binary and ternary intermetallics for advanced interconnect metallizationOral presentationInterconnects