3D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applications

Maggioni, FedericaFedericaMaggioniOprins, HermanHermanOprinsMilojevic, DragomirDragomirMilojevicBeyne, EricEricBeyneDe Wolf, IngridIngridDe WolfBaelmans, MartineMartineBaelmans2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/255923D-convolution based fast transient thermal model for 3D integrated circuits: methodology and applicationsProceedings paper