Modeling and Characterization of TSV-Induced Noise Coupling

Sun, XiaoXiaoSunRack, MartinMartinRackVan der Plas, GeertGeertVan der PlasRaskin, Jean-PierreJean-PierreRaskinBeyne, EricEricBeyne2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31883Modeling and Characterization of TSV-Induced Noise CouplingBook chapterhttps://www.crcpress.com/Noise-Coupling-in-System-on-Chip/Noulis/p/book/9781498796774