Low damage ULK etching by means of high boiling point organic condensation

Chanson, RomainRomainChansonHoltzer, NicolasNicolasHoltzerLefaucheux, PhilippePhilippeLefaucheuxDussart, RémiRémiDussartSHEN, PengPengSHENURABE, KeiichiroKeiichiroURABEDussarat, ChristianChristianDussaratMaekawa, KaoruKaoruMaekawayatsuda, koichikoichiyatsudaTahara, ShigeruShigeruTaharade Marneffe, Jean-FrancoisJean-Francoisde Marneffe2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28001Low damage ULK etching by means of high boiling point organic condensationMeeting abstracthttps://mrsspring.zerista.com/event/member/365505