30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning

Versluijs, JankoJankoVersluijsde Marneffe, Jean-FrancoisJean-Francoisde MarneffeGoossens, DannyDannyGoossensVandeweyer, TomTomVandeweyerWiaux, VincentVincentWiauxStruyf, HerbertHerbertStruyfMaenhoudt, MireilleMireilleMaenhoudtBrouri, MohandMohandBrouriVertommen, JohanJohanVertommenKim, Ji SooJi SooKimZhu, HelenHelenZhuSadjadi, RezaRezaSadjadi2021-10-182021-10-182009https://imec-publications.be/handle/20.500.12860/1649630-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterningJournal article