Analysis of process-induced stresses in lateral trench isolation structures for high voltage devices in bonded SOI wafers

Baumgart, H.H.BaumgartLetavic, T. J.T. J.LetavicDe Wolf, IngridIngridDe WolfMaes, HermanHermanMaesEgloff, R.R.Egloff2021-09-292021-09-291995https://imec-publications.be/handle/20.500.12860/516Analysis of process-induced stresses in lateral trench isolation structures for high voltage devices in bonded SOI wafersProceedings paper